Radiation detector

ABSTRACT

Provided is a radiation detector  1  capable of improving reliability associated with radiation detection. The radiation detector  1  includes: a supporting substrate  2  that can transmit radiation there-through; a scintillator layer  3  formed on one principal surface  2   a  of the supporting substrate  2,  the scintillator layer  3  including an incident surface  3   a  on which radiation is incident and an emission surface  3   b  emitting light generated by the incident radiation and on a side opposite to the incident surface  3   a;  and a light detection portion  5  disposed on an emission surface side of the scintillator layer  3  for detecting light emitted from the emission surface  3   b.

TECHNICAL FIELD

The present invention relates to a radiation detector that detects aradiation.

BACKGROUND ART

In the related art, techniques disclosed in Patent Literatures 1 and 2,for example, are known as a technique regarding a radiation detector.Patent Literature 1 discloses a radiation detection device that includesa flat plate-shaped supporting substrate that is made from a resin, alayered scintillator that is formed on one principal surface of thesupporting substrate, a moisture-proof protective layer that covers theouter sides of the supporting substrate and the scintillator, and asensor panel that is disposed in a portion of the scintillator closer toa side opposite to the supporting substrate so as to detect lightgenerated by the scintillator.

In the radiation detection device disclosed in Patent Literature 1, thesupporting substrate and the scintillator are attached to the sensorpanel by an adhesive layer. The adhesive layer is formed between thesupporting substrate and the sensor panel so as to cover the outerperiphery of the scintillator. Moreover, a sealing portion forpreventing an outflow of an adhesive agent is formed in the outerperiphery of the adhesive layer.

Patent Literature 2 discloses a radiation flat panel detector thatincludes a flat plate-shaped substrate that is made from a polymer film,a phosphor layer that is formed on the substrate, a moisture-proofprotective film that covers outer sides of the substrate and thephosphor layer, and a light receiving element that is disposed in aportion of the phosphor layer closer to a side opposite to the substrateso as to detect light generated in the phosphor layer.

CITATION LIST Patent Literature

Patent Literature 1: JP 2004-61115 A

Patent Literature 2: WO 2008/018277 A

SUMMARY OF INVENTION Technical Problem

However, in the above-described radiation detection device of therelated art, when the device is assembled, shrinkage stress resultingfrom curing of an adhesive agent is strongly applied to the outerperiphery of the scintillator. When a deformation occurs in thescintillator due to the effect of the stress, an adverse effect such asdeterioration of resolution occurs in the scintillator. Therefore, thereis a problem in that reliability associated with radiation detection bythe device decreases.

The present invention has been made in view of the above problem, and anobject of the present invention is to provide a radiation detectorcapable of improving reliability associated with radiation detection.

Solution to Problem

A radiation detector comprising: a radiation transmission substrate thatcan transmit radiation there-through; a scintillator layer formed on oneprincipal surface of the radiation transmission substrate, thescintillator layer including an incident surface on which radiation isincident and an emission surface emitting light generated by theincident radiation and on a side opposite to the incident surface; and alight detection portion disposed on an emission surface side of thescintillator layer for detecting light emitted from the emissionsurface, wherein a side surface of the scintillator layer is inclinedoutwardly as the side surface advances from the incident surface to theemission surface, and the radiation transmission substrate has an outeredge portion that reaches the side surface of the scintillator layer.

According to the radiation detector, the outer edge portion of theradiation transmission substrate extends to reach the side surface ofthe scintillator layer, and the outer periphery of the scintillatorlayer is reinforced by the substrate. Thus, when the scintillator layerand the light detection portion are attached, it is possible to suppressa deformation of the scintillator layer due to the effect of shrinkagestress resulting from curing of an adhesive agent. Moreover, in theradiation detector, the side surface of the scintillator layer isinclined toward the outer side as the side surface advances from theincident surface to the emission surface. Thus, it is possible toincrease deformation resisting power against shrinkage stress of theadhesive agent as compared to a case where the side surface of thescintillator layer is vertical to the emission surface or is inclined inthe opposite direction. Therefore, according to the radiation detector,it is possible to prevent deterioration of the performance of thescintillator layer resulting from a deformation of the scintillatorlayer. Accordingly, it is possible to improve reliability associatedwith radiation detection of the radiation detector.

In the radiation detector, the radiation transmission substrate may bemade from a polymer film.

According to the radiation detector, a flexible substrate made from apolymer film is used as the radiation transmission substrate. Thus, itis possible to deform the radiation transmission substrate and thescintillator so as to conform to the shape of the light detectionportion. As a result, in the radiation detector, since the gap betweenthe scintillator and the light detection portion can be suppressed to beas small as possible, it is possible to suppress deterioration of theresolution resulting from the presence of the gap between thescintillator and the light detection portion.

In the radiation detector, the radiation transmission substrate has anopposing end portion formed on an outer side of the outer edge portionsuch that the outer edge portion faces the light detection portion.

According to the radiation detector, the opposing end portion of theradiation transmission substrate is attached to the light detectionportion. In this way, it is possible to reliably fix the radiationtransmission substrate and the light detection portion with a smallamount of the adhesive agent as compared to a case where the opposingend portion is not provided.

The radiation detector may further include an adhesive layer thatattaches the scintillator layer and the radiation transmission substrateto the light detection portion.

According to the radiation detector, the emission surface of thescintillator layer and the opposing end portion of the radiationtransmission substrate are attached to the light detection portion bythe adhesive layer. In this way, it is possible to reliably fix thescintillator layer and the radiation transmission substrate to the lightdetection portion with a simple configuration.

The radiation detector may further include a moisture-proof protectivefilm covering outer sides of the radiation transmission substrate andthe scintillator layer, and the radiation transmission substrate and thescintillator layer may be attached to the adhesive layer via themoisture-proof protective film.

According to the radiation detector, since the moisture-proof protectivefilm suppresses moisture from entering into the scintillator layer, itis possible to prevent deterioration of the performance of thescintillator layer due to the entering moisture.

In the radiation detector, an angle between the emission surface and theside surface of the scintillator layer may be between 5° and 80°.

Further, in the radiation detector, the angle between the emissionsurface and the side surface of the scintillator layer may be between 5°and 45°.

Advantageous Effects of Invention

According to the present invention, it is possible to improvereliability associated with radiation detection.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view illustrating an embodiment of aradiation detector according to the present invention.

FIG. 2 is an enlarged cross-sectional view illustrating an inclinationangle of a scintillator layer.

FIG. 3 is a cross-sectional view illustrating a scintillator layerforming step.

FIG. 4 is a perspective view illustrating the scintillator layer formingstep.

FIG. 5 is an enlarged cross-sectional view illustrating an inclinationangle during forming in the scintillator layer forming step.

FIG. 6 is a cross-sectional view illustrating a protective film formingstep.

FIG. 7 is a cross-sectional view illustrating an attachment step.

FIG. 8 is a cross-sectional view illustrating a deformation step.

DESCRIPTION OF EMBODIMENTS

Hereinafter, a preferred embodiment of the present invention will bedescribed in detail with reference to the drawings. In addition, in thedescription of the drawings, the same or corresponding portions will bedenoted by the same reference numerals, and redundant descriptionthereof will not be provided.

As illustrated in FIG. 1, a radiation detector 1 according to thepresent embodiment is configured to detect a radiation such as an X-rayby converting the radiation into light and is used, for example, in apositron emission tomography (PET) apparatus or a computed tomography(CT) apparatus. The radiation detector 1 includes a supporting substrate2, a scintillator layer 3, a moisture-proof protective film 4, a lightdetection portion 5, and an adhesive layer 6.

The supporting substrate 2 is a radiation transmission substrate thattransmits a radiation such as an X-ray. The supporting substrate 2 is aflexible substrate made from a polymer film having a thickness ofapproximately 100 μm. An example of a polymer that forms the supportingsubstrate 2 includes polyimide. The scintillator layer 3 is depositedand formed on one principal surface 2 a of the supporting substrate 2.

The supporting substrate 2 is formed in a thin dish shape such that theprincipal surface 2 a is on the inner side. The supporting substrate 2includes an outer edge portion 2 b that is inclined toward the principalsurface 2 a and an opposing end portion 2 c that is formed on an outerside of the outer edge portion 2 b. The outer edge portion 2 b is formedalong the outer periphery of the supporting substrate 2. The outer edgeportion 2 b extends to reach a side surface 3 c of the scintillatorlayer 3. The outer edge portion 2 b is inclined along the side surface 3c of the scintillator layer 3. Moreover, the opposing end portion 2 c isformed in a flange form on the outer side of the outer edge portion 2 b.The opposing end portion 2 c is formed so as to face the light detectionportion 5 in a thickness direction of the supporting substrate 2.

The scintillator layer 3 is made from columnar crystals of cesium iodide(CsI) doped with thallium (Tl), for example. The scintillator layer 3 isformed by growing columnar crystals on the principal surface 2 a of thesupporting substrate 2 by a vapor deposition method. The thickness ofthe scintillator layer 3 is 600 μm, for example. The scintillator layer3 has an approximately quadrangular pyramid shape. The scintillatorlayer 3 having an approximately quadrangular pyramid shape has anincident surface 3 a and an emission surface 3 b that are approximatelyparallel to each other, and side surfaces 3 c.

The incident surface 3 a is a surface on which a radiation having passedthrough the supporting substrate 2 is incident. The incident surface 3 ais formed along the principal surface 2 a of the supporting substrate 2.The emission surface 3 b is a surface from which light generated withinthe scintillator layer 3 due to the incident radiation is emitted. Theemission surface 3 b is formed on a side opposite to the incidentsurface 3 a. The emission surface 3 b has a larger area than theincident surface 3 a.

The side surface 3 c is a surface that is inclined in relation to theincident surface 3 a and the emission surface 3 b. The side surface 3 cis inclined toward the outer side as it advances from the incidentsurface 3 a to the emission surface 3 b. Although an effective areaincreases as an inclination angle α between the side surface 3 c and theemission surface 3 b approaches 90°, the smaller the inclination angle,the easier it is to bond a flexible substrate. Thus, the inclinationangle a may be between 5° and 80° and may be between 5° and 45° from theperspective of improving workability and decreasing deformation of theside surface 3 c. Moreover, the side surface 3 c is covered with theouter edge portion 2 b. A radiation having passed through the supportingsubstrate 2 is incident on the side surface 3 c.

The moisture-proof protective film 4 is a protective film for preventingmoisture from entering into the scintillator layer 3. The moisture-proofprotective film 4 is made from polyparaxylylene, for example. Themoisture-proof protective film 4 covers the outer sides of thesupporting substrate 2 and the scintillator layer 3. The supportingsubstrate 2 and the scintillator layer 3 are sealed by themoisture-proof protective film 4. The supporting substrate 2 and thescintillator layer 3 have flexible properties in a state of being sealedby the moisture-proof protective film 4.

The light detection portion 5 is an image sensor that detects lightemitted from the emission surface 3 b of the scintillator layer 3. Acharge coupled device (CCD) image sensor, a photodiode array, or thelike is used as the light detection portion 5. The light detectionportion 5 has an approximately flat plate shape. The light detectionportion 5 is disposed in a portion of the scintillator layer 3 closer tothe emission surface 3 b. Specifically, the light detection portion 5has a light receiving surface 5 a that detects light and is disposed toface the emission surface 3 b of the scintillator layer 3. The lightdetection portion 5 is attached to the supporting substrate 2 and thescintillator layer 3 by an adhesive layer 6.

The adhesive layer 6 is made from a resin having low moisturepermeability such as an epoxy-based resin, a urethane-based resin, or asilicone-based resin. The adhesive layer 6 is formed between thesupporting substrate 2 and scintillator layer 3 and the light detectionportion 5. The adhesive layer 6 is attached to the emission surface 3 bof the scintillator layer 3 through the moisture-proof protective film 4interposed. Moreover, the adhesive layer 6 is attached to the opposingend portion 2 c of the supporting substrate 2 through the moisture-proofprotective film 4 interposed. The adhesive layer 6 is attached to thesupporting substrate 2 and the scintillator layer 3 through themoisture-proof protective film 4 interposed and is also attached to thelight receiving surface 5 a of the light detection portion 5. In thisway, the adhesive layer 6 attaches and fixes the supporting substrate 2and the scintillator layer 3 to the light detection portion 5.

Next, a method for manufacturing the radiation detector 1 according tothe present embodiment will be described with reference to the drawings.

FIGS. 3 to 5 are diagrams illustrating a scintillator forming step offorming the scintillator layer 3 on the supporting substrate 2. FIG. 6is a diagram illustrating a protective film forming step of forming themoisture-proof protective film 4. FIG. 7 is a diagram illustrating anattachment step of attaching the supporting substrate 2 and thescintillator layer 3 to the light detection portion 5. FIGS. 8( a) and8(b) are diagrams illustrating a deformation step of deforming thesupporting substrate 2 and the scintillator layer 3. Specifically, FIG.8( a) illustrates the supporting substrate 2 and the scintillator layer3 when the deformation step starts. FIG. 8( b) illustrates thesupporting substrate 2 and the scintillator layer 3 when the deformationstep ends.

First, in the scintillator layer forming step illustrated in FIGS. 3 to5, the scintillator layer 3 is formed on the principal surface 2 a ofthe supporting substrate 2. In the scintillator layer forming step, thesupporting substrate 2 is fixed to a reinforcing plate having asufficient rigidity. After that, Tl-doped CsI is vapor-deposited on theprincipal surface 2 a in a state where the supporting substrate 2 andthe reinforcing plate are rotated, whereby the scintillator layer 3 isformed.

The scintillator layer 3 is formed in a region of the principal surface2 a of the supporting substrate 2 closer to the center. That is, anon-coated area on which the scintillator layer 3 is not formed isformed on the outer side of the principal surface 2 a. A width N of thenon-coated area illustrated in FIG. 5 is preferably small from theperspective of decreasing a constituent member and is preferably largefrom the perspective of improving assembling workability. The width N ofthe non-coated area may be in the range of 1 mm to 10 mm, for example.The non-coated area corresponds to a region that corresponds to theabove-described opposing end portion 2 c of the principal surface 2 a.

The scintillator layer 3 formed in the scintillator layer forming stephas an approximately quadrangular pyramid shape such that thescintillator layer broadens as it advances from the emission surface 3 bto the incident surface 3 a. The scintillator layer 3 in this stage hassuch a structure that the area of the incident surface 3 a is largerthan the area of the emission surface 3 b, and an inclined state of theside surface 3 d is different from that of the side surface 3 c ofFIG. 1. The side surface 3 d protrudes outward as it advances from theemission surface 3 b to the incident surface 3 a. An inclination angle βbetween the side surface 3 d and the emission surface 3 b may be greaterthan 90° and smaller than 180°. The inclination angle β may be in therange of 100° to 175° and may be in the range of 135° to 175°.

Subsequently, in the protective film forming step illustrated in FIG. 6,the moisture-proof protective film 4 is formed. In the protective filmforming step, the supporting substrate 2 on which the scintillator layer3 is formed is input into a vapor deposition chamber of a chemical vapordeposition (CVD) apparatus. Moreover, by a CVD method of exposing thesupporting substrate 2 to vapor that is obtained by sublimating the rawmaterial of polyparaxylylene, the moisture-proof protective film 4 isformed so as to cover the outer sides of the supporting substrate 2 andthe scintillator layer 3. The supporting substrate 2 and thescintillator layer 3 have sufficient flexible properties in a state ofbeing covered by the moisture-proof protective film 4.

Subsequently, in the attachment step illustrated in FIG. 7, thesupporting substrate 2 and the scintillator layer 3 that are covered bythe moisture-proof protective film 4 are attached to the light detectionportion 5. In the attachment step, first, the adhesive layer 6 is formedon the light receiving surface 5 a of the light detection portion 5.After the adhesive layer 6 is formed, the supporting substrate 2 and thescintillator layer 3 are attached to the light detection portion 5 sothat the emission surface 3 b of the scintillator layer 3 faces thelight receiving surface 5 a of the light detection portion 5.

After that, in the deformation step illustrated in FIGS. 8( a) and 8(b),the supporting substrate 2 and the scintillator layer 3 are deformed soas to extend along the light receiving surface 5 a of the lightdetection portion 5. In this deformation step, the supporting substrate2 and the scintillator layer 3 having flexible properties are deformedby pressing the same toward the light detection portion 5. Due to thepressing, the supporting substrate 2 and the scintillator layer 3 aredeformed from the state illustrated in FIG. 8( a) to the stateillustrated in FIG. 8( b). The supporting substrate 2 and thescintillator layer 3 are deformed so as to be closely attached along thelight receiving surface 5 a of the light detection portion 5.

Specifically, in the scintillator layer 3, the side surface 3 d ispressed against the light receiving surface 5 a of the light detectionportion 5 and is deformed to be the same surface as the emission surface3 b. At the same time, a portion of the incident surface 3 a of thescintillator layer 3 is deformed to form the side surfaces 3 c.

On the other hand, with the deformation of the scintillator layer 3, thesupporting substrate 2 is deformed from the flat plate shape illustratedin FIG. 8( a) into an approximately shallow dish shape illustrated inFIG. 8( b). Due to this deformation, the outer edge portion 2 b and theopposing end portion 2 c are formed on the outer periphery side of thesupporting substrate 2. The outer edge portion 2 b is formed by beingbent so as to extend along the side surface 3 c in accordance with theforming of the side surface 3 c of the scintillator layer 3. The outeredge portion 2 b is inclined along the side surface 3 c of thescintillator layer 3. The opposing end portion 2 c is moved toward thelight detection portion 5 in accordance with the forming of the outeredge portion 2 b. Due to this movement, the principal surface 2 a (theabove-described non-coated area) of the opposing end portion 2 c and theadhesive layer 6 are attached through the moisture-proof protective film4 interposed. The area of the non-coated area corresponds to the area ofthe opposing end portion 2 c attached to the adhesive layer 6.

After the respective steps described above are executed, the adhesivelayer 6 is cured, and a predetermined finishing treatment is performed.In this way, the radiation detector 1 illustrated in FIG. 1 is obtained.

Subsequently, operations and effects of the radiation detector 1according to the present embodiment will be described.

According to the radiation detector 1 of the present embodiment, theouter edge portion 2 b of the supporting substrate 2 extends to reachthe side surface 3 c of the scintillator layer 3, and the outerperiphery of the scintillator layer 3 is reinforced by the supportingsubstrate 2. Thus, when the scintillator layer 3 and the light detectionportion 5 are attached, it is possible to suppress a deformation of thescintillator layer 3 due to the effect of shrinkage stress resultingfrom curing of an adhesive agent. Moreover, the side surface 3 c of thescintillator layer 3 is inclined toward the outer side as the sidesurface 3 c advances from the incident surface 3 a to the emissionsurface 3 b. Thus, it is possible to increase deformation resistingpower against shrinkage stress of an adhesive agent as compared to acase where the side surface 3 c of the scintillator layer 3 is verticalto the emission surface 3 b or is inclined in the opposite direction.Therefore, according to the radiation detector 1, it is possible toprevent deterioration of the performance of the scintillator layer 3resulting from a deformation of the scintillator layer 3. Accordingly,it is possible to improve reliability associated with radiationdetection of the radiation detector 1.

Moreover, according to the radiation detector 1, a flexible substratemade from a polymer film is used as the supporting substrate 2. Thus, itis possible to deform the supporting substrate 2 and the scintillatorlayer 3 so as to conform to the shape of the light detection portion 5.As a result, since the gap between the scintillator layer 3 and thelight detection portion 5 can be decreased, it is possible to suppressdeterioration of the resolution resulting from the gap between thescintillator layer 3 and the light detection portion 5. Moreover, sincea flexible substrate is used as the supporting substrate 2, it ispossible to form the outer edge portion 2 b easily.

Further, according to the radiation detector 1, the outer edge portion 2b of the supporting substrate 2 extends to reach the side surface 3 c ofthe scintillator layer 3. Thus, the distance between the supportingsubstrate 2 and the light detection portion 5 is small as compared to acase where the supporting substrate 2 has a flat plate shape such thatthe supporting substrate 2 does not extend to reach the side surface 3 cof the scintillator layer 3. Therefore, it is possible to attach thesupporting substrate 2 and the light detection portion 5 with a smallamount of the adhesive agent. Moreover, according to the radiationdetector 1, the opposing end portion 2 c is provided on the outer sideof the outer edge portion 2 b so as to face the light detection portion5. Thus, it is possible to reliably fix the supporting substrate 2 andthe light detection portion 5 with a small amount of the adhesive agentas compared to a case where the opposing end portion 2 c is notprovided. Therefore, in the radiation detector 1, it is possible torealize attachment between the supporting substrate 2 and scintillatorlayer 3 and the light detection portion 5 just by applying a smalleramount of the adhesive agent to the light receiving surface 5 a of thelight detection portion 5 as compared to the related art. Accordingly,it is not necessary to provide a sealing member that surrounds theperiphery of the adhesive layer in order to prevent an outflow of theadhesive agent that is not cured. As a result, it is possible to improveassembling workability and reduce the number of constituent members.

Moreover, according to the radiation detector 1, the emission surface 3b of the scintillator layer 3 and the opposing end portion 2 c of thesupporting substrate 2 are attached to the light detection portion 5 bythe adhesive layer 6. In this way, it is possible to fix thescintillator layer 3 and the supporting substrate 2 to the lightdetection portion 5 with a simple configuration.

Moreover, according to the radiation detector 1, since themoisture-proof protective film 4 is provided so as to cover the outersides of the supporting substrate 2 and the scintillator layer 3, it ispossible to suppress moisture from entering into the scintillator layer3. Further, in the radiation detector 1, since the side surface 3 c ofthe scintillator layer 3 is covered by the outer edge portion 2 b of thesupporting substrate 2, entering of moisture into the scintillator layer3 is suppressed as compared to a case where the side surface 3 c of thescintillator layer 3 is not covered by the supporting substrate 2.Therefore, according to the radiation detector 1, it is possible toprevent deterioration of the scintillator layer 3 due to enteringmoisture. This contributes to extending the lifespan of the radiationdetector 1.

The present invention is not limited to the above-described embodiment.

For example, the material of the supporting substrate 2 is not limitedto a polymer film, and aluminum may be used. Moreover, the supportingsubstrate 2 does not always have to have flexible properties.

Moreover, the side surface 3 c of the scintillator layer 3 does notalways have to be entirely covered by the supporting substrate 2, andonly a portion may be covered. Further, the opposing end portion 2 c ofthe supporting substrate 2 does not have to be attached to the adhesivelayer 6. That is, the scintillator layer 3 is not limited to beingsealed by the supporting substrate 2 and the adhesive layer 6, and a gapmay be formed in a lateral side of the scintillator layer 3. Moreover,the flange-shaped opposing end portion 2 c does not always have to beformed. Further, the moisture-proof protective film 4 does not alwayshave to be formed.

INDUSTRIAL APPLICABILITY

The present invention can be used in a radiation detector.

Reference Signs List

1 . . . radiation detector; 2 . . . supporting substrate (radiationtransmission substrate); 2 a . . . principal surface; 2 b . . . outeredge portion; 2 c . . . opposing end portion; 3 . . . scintillatorlayer; 3 a . . . incident surface; 3 b . . . emission surface; 3 c . . .side surface; 4 . . . moisture-proof protective film; 5 . . . lightdetection portion; 6 . . . adhesive layer; α . . . slope angle

1-7. (canceled)
 8. A method for manufacturing a radiation detectorhaving, a radiation transmission substrate configured to transmitradiation there through; a scintillator layer formed on one principalsurface of the radiation transmission substrate, the scintillator layerincluding an incident surface on which radiation is incident and anemission surface emitting light generated by the incident radiation andon a side opposite to the incident surface; and a light detectionportion disposed on an emission surface side of the scintillator layerfor detecting light emitted from the emission surface, wherein a sidesurface of the scintillator layer is inclined outwardly as the sidesurface advances from the incident surface to the emission surface, andthe radiation transmission substrate has an outer edge portion thatreaches the side surface of the scintillator layer, the method formanufacturing the radiation detector comprising: a scintillator layerforming step of forming the scintillator layer having a side surfaceinclining outwardly as the side surface advances from the emissionsurface to the incident surface by growing columnar crystals on the oneprincipal surface of the radiation transmission substrate; a disposingstep of disposing the one principal surface of the radiationtransmission substrate on which the scintillator layer was formed in thescintillator layer forming step to face the light detection portion; anda deformation step of deforming the scintillator layer such that theside surface inclining outwardly as the side surface advances from theemission surface to the incident surface becomes a side surfaceinclining outwardly as the side surface advances from the incidentsurface to the emission surface, by pressing the radiation transmissionsubstrate towards the opposing light detection portion.
 9. The methodfor manufacturing a radiation detector according to claim 8, wherein theradiation transmission substrate is made from a polymer film.
 10. Themethod for manufacturing a radiation detector according to claim 8,wherein the radiation transmission substrate deformed in the deformationstep has an opposing end portion formed on an outer side of the outeredge portion such that the outer edge portion faces the light detectionportion.
 11. The method for manufacturing a radiation detector accordingto claim 8, wherein the disposing step includes an attachment step forattaching the one principal surface of the radiation transmissionsubstrate to face the light detection portion, via an adhesive layerprovided to attach the radiation transmission substrate and thescintillator layer formed in the scintillator layer forming step to thelight detection portion, in the attachment step.
 12. The method formanufacturing a radiation detector according to claim 11, furthercomprising: a protective film forming step for providing amoisture-proof protective film covering the scintillator layer formed inthe scintillator layer forming step and outer sides of the radiationtransmission substrate, wherein in the attachment step, the scintillatorlayer and the radiation transmission substrate are attached to theadhesive layer via the moisture-proof protective film.
 13. The methodfor manufacturing a radiation detector according to claim 8, wherein anangle between the emission surface and the side surface of thescintillator layer formed in the deformation step is 5° to 80°.
 14. Themethod for manufacturing a radiation detector according to claim 13,wherein the angle between the emission surface and the side surface ofthe scintillator layer formed in the deformation step is 5° to 45°. 15.The method for manufacturing a radiation detector according to claim 9,wherein the radiation transmission substrate deformed in the deformationstep has an opposing end portion formed on an outer side of the outeredge portion such that the outer edge portion faces the light detectionportion.
 16. The method for manufacturing a radiation detector accordingto claim 9, wherein the disposing step includes an attachment step ofattaching the one principal surface of the radiation transmissionsubstrate to face the light detection portion, via an adhesive layerprovided to attach the radiation transmission substrate and thescintillator layer formed in the scintillator layer forming step to thelight detection portion, in the attachment step.
 17. The method formanufacturing a radiation detector according to claim 10, wherein thedisposing step includes an attachment step of attaching the oneprincipal surface of the radiation transmission substrate to face thelight detection portion, via an adhesive layer provided to attach theradiation transmission substrate and the scintillator layer formed inthe scintillator layer forming step to the light detection portion, inthe attachment step.
 18. The method for manufacturing a radiationdetector according to claim 15, wherein the disposing step includes anattachment step of attaching the one principal surface of the radiationtransmission substrate to face the light detection portion, via anadhesive layer provided to attach the radiation transmission substrateand the scintillator layer formed in the scintillator layer forming stepto the light detection portion, in the attachment step.
 19. The methodfor manufacturing a radiation detector according to claim 9, wherein anangle between the emission surface and the side surface of thescintillator layer formed in the deformation step is 5° to 80°.
 20. Themethod for manufacturing a radiation detector according to claim 10,wherein an angle between the emission surface and the side surface ofthe scintillator layer formed in the deformation step is 5° to 80°. 21.The method for manufacturing a radiation detector according to claim 11,wherein an angle between the emission surface and the side surface ofthe scintillator layer formed in the deformation step is 5° to 80°. 22.The method for manufacturing a radiation detector according to claim 12,wherein an angle between the emission surface and the side surface ofthe scintilla tot layer formed in the deformation step is 5° to 80°. 23.The method for manufacturing a radiation detector according to claim 15,wherein an angle between the emission surface and the side surface ofthe scintillator layer formed in the deformation step is 5° to 80°. 24.The method for manufacturing a radiation detector according to claim 16,wherein an angle between the emission surface and the side surface ofthe scintillator layer formed in the deformation step is 5° to 80°. 25.The method for manufacturing a radiation detector according to claim 17,wherein an angle between the emission surface and the side surface ofthe scintillator layer formed in the deformation step is 5° to 80°. 26.The method for manufacturing a radiation detector according to claim 18,wherein an angle between the emission surface and the side surface ofthe scintillator layer formed in the deformation step is 5° to 80°. 27.The method for manufacturing a radiation detector according to claim 19,wherein the angle between the emission surface and the side surface ofthe scintillator layer formed in the deformation step is 5° to 45°.